XH COIN417G² Uncooled Infrared Core

Upgraded Wafer-Level Infrared Core Solution

COIN417G² Infrared Thermal Imaging Core
The COIN417G² infrared thermal imaging core is based on High-tech’s new-generation wafer-level infrared detector. It features advanced TEC-free technology, a newly upgraded circuit design, and industry-leading image processing algorithms, delivering faster imaging speed, clearer image quality, and further reduced power consumption.
The COIN417G² infrared thermal imaging core provides a variety of industry-standard interfaces, enabling easier secondary development and rapid system integration.

Resolution: 384 × 288

Pixel Pitch: 17 μm

Spectral Range: 8–14 μm

Typical NETD: ≤ 40 mK

Product Features

Fast Imaging & Lower Power Consumption

• Startup time: 5 s
• Power consumption as low as 0.75 W

Clear Imaging & Accurate Temperature Measurement

• Next-generation image algorithms including NUC / 3DNR / DNS / DRC / EE
• -20°C to 150°C, 0–550°C, customizable extended temperature measurement ranges supported

Multiple Interfaces for Fast Integration

• Multiple image output interfaces: USB 2.0 / DVP / LVDS
• RAW / YUV image data output with serial port control

Applications
  • Industrial Temperature Measurement
    Industrial Temperature Measurement
  • Security Surveillance
    Security Surveillance
  • UAV Payload
    UAV Payload
  • Night Vision Observation
    Night Vision Observation
Technical Specifications
Product ModelCOIN417G²/R Uncooled Infrared Standard Core
Detector Performance
Sensing MaterialVanadium Oxide (VOx)
Resolution384 × 288
Pixel Pitch17 μm
Spectral Range8 μm ~ 14 μm
Typical NETD≤ 40 mK
Image Processing
Digital Frame Rate50 Hz / 30 Hz / 25 Hz
Startup Time5 s
Analog VideoPAL / NTSC
Digital VideoYUV / BT.656 / LVDS / USB 2.0
Image AlgorithmsNon-Uniformity Correction (NUC)  3D Noise Reduction (3DNR)  2D Noise Suppression (DNS)  Dynamic Range Compression (DRC)  Edge Enhancement (EE)
Image DisplayWhite Hot / Black Hot / Pseudo Color
PC Software
ICC SoftwareCore control and video display
Electrical Characteristics
Standard External Interface50-Pin HRS Connector: DF40C-50DP-0.4V(51), HRS, Male
USB Expansion BoardType-C
Communication InterfaceTTL-232 / USB 2.0
Digital Video InterfaceCMOS8 / CMOS16 / LVDS / USB 2.0
Power Supply Range4 ~ 5.5 V
Typical Power Consumption0.75 W
Temperature Measurement
Operating Temperature (Measurement)-10°C ~ +50°C
Measurement Range-20°C ~ 150°C, 0°C ~ 550°C, customizable extended ranges supported
Measurement Accuracy±3°C or ±3% (whichever is greater)
Area MeasurementSupports area temperature measurement; outputs maximum, minimum, and average values
SDKWindows / Linux / ARM versions, supporting video stream parsing and grayscale-to-temperature conversion
Physical Characteristics
Dimensions (mm)25.4 × 25.4 × 16 (bare core)
Weight12.8 g (bare core)
Environmental Specifications
Operating Temperature-40°C ~ +70°C
Storage Temperature-45°C ~ +85°C
Humidity5% ~ 95%, non-condensing
Vibration5.35 grms, 3 axes
ShockHalf-sine wave, 40 g / 11 ms, 3 axes, 6 directions
CertificationRoHS 2.0 / REACH
Optical Lens
LensFixed-focus athermalized: 4.9 mm / 9.1 mm / 13 mm / 19 mm / 25 mm
ProtectionFront lens IP67

 

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