XH TM120

TM Series 120×90 VOx Uncooled Thermal Module

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TM120 is one of the TM series miniature infrared modules developed by XINGHE. It integrates optical lens, 120×90/17μm wafer level package (WLP) detector and basic image processing circuit to quickly obtain thermal images of the target area and heat distribution.

TM120 thermal imaging core is oriented for small size, light weight & low price (SWaP) infrared imaging applications. Its super miniature structure and ultralow power consumption are convenient to be integrated into various smart devices, thermal imagers or mobile terminals with strict requirements on cost, size and weight.

Now TM series thermal cores and modules have been widely used in consumer electronics market. It’s easier for TIMO thermal camera core module to be integrated into more terminal products and greatly reduces the cost of customers.

Main Features:

Main Features:
Low Cost & Fast Integration

Minimum WLP infrared module; size 8.5mmx8.5mmx9.16mm

DVP Interface, compatible with various embedded platforms

Visible camera module equivalent for directly integration

Provide software development kit

Long Operating Time

Ultra-low power consumption, as low as 10mW

Specifications:

ModelTM120
Performance
Sensitive MaterialVanadium Oxide
Resolution120×90
Pixel Size17μm
Spectral Range8~14μm
FOV50°±1°/ 90°±5°
NETD≤60mK
Frame Rate25Hz (Customizable 1~30Hz)
Focusing ModeFree
Measurement & Analysis
Temperature Measurement Range① Industrial Thermography: -20℃~150℃, 100℃~400℃ (Auto Shift)
② Body Temperature Screening: 20℃~50℃ (Accurate Range: 28~40℃)
Temperature Measurement Accuracy① Industrial Thermography: Greater of ±2℃ or ±2%
② Body Temperature Screening: ±0.5℃
External Interface34PIN (FOV: 50°)
40PIN (FOV: 90°)
Typical Power Consumption45mW@25Hz, 16mW@9Hz, 10mW@≤4Hz
SDKAndroid/ Linux/ Windows
Environmental Specifications
Storage Temperature-40℃~85℃
CertificateRoHS
Physical Characteristics
Size (mm)8.5×8.5×9.16 (FOV: 50°)
12x10x5.58 (FOV: 90°)
Weight≤2g

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